Glass cloth base epoxy resin
Flame retardant copper clad laminate
Features
The CAF resistance materials can withstand CAF testing for 2000 hours at 85℃∕85%RH∕50V DC.
It can keep high CAF resistance more than two times of standard FR- 4 materials.
High luminance of epoxy contrast with copper for laser type A.O.I.
UV solder mask maybe applied simultaneously to increase yields.
Other properties are similar to standard FR- 4 materials.
Products
UV Block FR- 4-86、NP-170R.
NP-140TL、NP-170TL.
NP-140B、NP-170B Prepreg.
NP-140B Prepreg
Performance List
Specification：IPC- 4101 is applicable
Glass style
RC%
RF%
GT sec
(170°C)
VC%
Scaled Flow
Thickness (per ply)
mm
mil
7628LF
45±3
20±5
130±20
0.75↓
0.180±0.01
7.1±0.4
7628HR
50±3
28±5
0.200±0.01
7.9±0.4
7628MR
47±3
25±5
0.190±0.01
7.5±0.4
7628
43±3
20±5
0.180±0.01
7.1±0.4
1506MR
52±3
30±5
0.160±0.01
6.3±0.4
1506
48±3
25±5
0.150±0.01
6.0±0.4
2116HR
58±3
35±5
0.130±0.01
5.0±0.4
2116MR
54±3
30±5
0.118±0.01
4.6±0.4
2116
50±3
25±5
0.105±0.01
4.1±0.4
2313
55±3
25±5
0.090±0.01
3.5±0.4
2113
56±3
30±5
0.090±0.01
3.5±0.4
2112
60±3
35±5
0.075±0.008
3.0±0.3
1080HR
68±3
45±5
0.071±0.008
2.8±0.3
1080MR
65±3
40±5
0.068±0.008
2.7±0.3
1080
62±3
35±5
0.065±0.008
2.6±0.3
106
68±3
40±5
0.053±0.008
2.1±0.3
Data shown are nominal values for reference only
NP-170B Prepreg
Performance List
Specification：IPC- 4101 is applicable
Glass style
RC%
RF%
GT sec
(170°C)
VC%
Scaled Flow
Thickness (per ply)
mm
mil
7628HR
50±3
28±5
130±20
0.75↓
0.193±0.01
7.6±0.4
7628MR
47±3
25±5
0.183±0.01
7.2±0.4
7628
43±3
20±5
0.173±0.01
6.8±0.4
1506MR
52±3
30±5
0.157±0.01
6.2±0.4
1506
48±3
25±5
0.145±0.01
5.7±0.4
2116HR
58±3
35±5
0.120±0.01
4.7±0.4
2116MR
54±3
30±5
0.109±0.01
4.3±0.4
2116
50±3
25±5
0.097±0.01
3.8±0.4
2113
56±3
30±5
0.081±0.01
3.2±0.4
2112
60±3
35±5
0.069±0.008
2.7±0.3
1080HR
68±3
45±5
0.064±0.008
2.5±0.3
1080MR
65±3
40±5
0.061±0.008
2.4±0.3
1080
62±3
35±5
0.058±0.008
2.3±0.3
106
68±3
40±5
0.046±0.008
1.8±0.3
Data shown are nominal values for reference only
Storage Stability
Storage Conditiion : 20°C 50% RH for 3 month
Max 5°C for 6 months
UV Block FR- 4-86，NP-140TL
Performance List
Specification：IPC- 4101 is applicable
Characteristics
Unit
Conditioning
Typical
Values
SPEC
Volume resistivity
MΩ-cm
C-96-35/ 90
5.0x10
10↑
Surface resistivity
MΩ
C-96/ 35/ 90
5.0x10
10↑
Permittivity 1MHZ
-
C-24/ 23/ 50
4.2~4.8
5.4↓
Loss Tangent 1MHZ
-
C-24/ 23/ 50
0.010~0.016
0.035↓
Arc resistance
SEC
D-48/ 50+D-0.5/ 23
120↑
60↑
Dielectric breakdown
KV
D-48/ 50
60↑
40↑
Moisture absorption
%
D-24/23
＜0.78mm
0.18
0.80↓
≧0.78mm
0.15
0.35↓
Flammability
-
C-24/ 23/ 50+E-24
/ 125
94V0
94V0
Peel strength 1oz
lb/ in
288℃x10” solder floating
10-14
8↑
Thermal stress
SEC
288℃ solder dipping
90↑
10↑
Glass transition temp
°C
DSC
140±5
N/A
Dimensional stability X-Y axis
%
E-4/ 105
0.01~0.03
0.05↓
Coefficient of thermal expansion
Z-axis before Tg
Z-axis after Tg
in/ in℃
in/ in℃
TMA
TMA
5.0x10
25.0x10
N/A
Data shown are nominal values for reference only
NP-170R，NP-170TL
Performance List
Specification：IPC- 4101 is applicable
Characteristics
Unit
Conditioning
Typical
Values
SPEC
Volume resistivity
MΩ-cm
C-96-35/ 90
5.0x10
10↑
Surface resistivity
MΩ
C-96/ 35/ 90
4.0x10
10↑
Permittivity 1MHZ
-
C-24/ 23/ 50
4.2~4.8
5.4↓
Loss Tangent 1MHZ
-
C-24/ 23/ 50
0.010~0.016
0.035↓
Arc resistance
SEC
D-48/ 50+D-0.5/ 23
120↑
60↑
Dielectric breakdown
KV
D-48/ 50
60↑
40↑
Moisture absorption
%
D-24/23
＜0.78mm
0.18
0.80↓
≧0.78mm
0.15
0.35↓
Flammability
-
C-24/ 23/
50+E-24/ 125
94V0
94V0
Peel strength 1oz
lb/ in
288°Cx10” solder floating
10
8↑
Thermal stress
SEC
288°C dipping
240↑
10↑
Glass transition temp
°C
DSC
170±5
N/A
Dimensional stability X-Y axis
%
E-4/ 105
0.01~0.03
0.05↓
Coefficient of thermal expansion
Z-axis before Tg
Z-axis after Tg
in/ in℃
in/ in℃
TMA
TMA
5.0x10
25.0x10
N/A
Data shown are nominal values for reference only
Product Size & Thickness
Thickness Inch(mm)
Copper Cladding
OZ(µm)
Size
Inch
mm
0.004(0.1)
to
0.125(3.2)
0.5 (17)
1.0 (35)
2.0 (70)
48.8×36.6
1240×0930
48.8×40.5
1240×1030
48.8×42.5
1240×1080
keeping the core and prepreg in the same grain direction is crucial to ensure the flatness of multilayer boards Grain direction is shown on the Certificate Conformance.
CAF Formation
CAF：Conductive Anodic Filament
CAF resistance comparison
Specimen：4-layer multilayer.
Test condition：85℃∕85%RH∕DC 50V bias.
Measured point：between PTH (Hole wall to hole wall＝0.5 mm).
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