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CEM-1 |
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CEM-3 |
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FR-4 |
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FR-5 |
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Prepreg |
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High Performance Materials |
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Resin Coated Copper Foil |
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| Features |
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Higher glass transition temperature |
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Easy to drill by CO2 laser |
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Excellent filling ability |
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Even surface for fine line and space usage |
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Lower dielectric constant |
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Traditional FR-4 processability |
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Thin dielectric and light weight |
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UL File number E98983(s) |
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| Product Thickness |
| Characteristics |
Unit |
Typical Values |
| Copper |
μm |
12 (3/8 oz) |
| 18 (1/2 oz) |
| 36 (1 oz) |
| Resin Thickness |
μm |
35 - 110 |
| Performance List |
| Characteristics |
Unit |
Conditioning |
Typical Values |
Glass Transition
Temperature |
°C |
TMA |
160±5 |
| °C |
| DSC |
180±5 |
Coefficient of Thermal
Expansion (Before Tg) |
In/ in/ °C |
TMA |
6x10 ~9x10 |
| Surface Flatness |
μm |
- |
2-3 |
| Flammability |
- |
C-24/ 23/ 50+E-24/ 125 |
V-0 |
| Peel Strength H oz |
lb/ in |
288°Cx10” solder dipping |
7-8 |
| Thermal Stress |
SEC |
288°C solder dipping |
120↑ |
| Permittivity 1MHZ |
- |
C-24/ 23/ 50 |
3.6-3.8 |
| Loss Tangent 1MHZ |
- |
C-24/ 23/ 50 |
0.02-0.04 |
| Surface Resistivity |
MΩ |
C-96/ 35/ 90 |
1.0x10 |
| Volume Resistivity |
MΩ-cm |
C-96/ 35/ 90 |
3.0x10 |
Data shown are nominal values for reference only.
| Performance List |
| A. Dielectric Constant (εr) |
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1MHz |
2MHz |
5MHz |
10MHz |
100MHz |
500MHz |
1GHz |
| FR4 -1.6 |
4.6007 |
4.5509 |
4.4014 |
4.3561 |
4.2628 |
4.1641 |
4.1101 |
| NPRCC |
3.7453 |
3.6973 |
3.5533 |
3.4827 |
3.332 |
3.2497 |
3.2231 |
| Test Condition : C-24/ 23/ 50 |
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| B. Dissipation Factor (tand) |
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1MHz |
2MHz |
5MHz |
10MHz |
100MHz |
500MHz |
1GHz |
| FR4 -1.6 |
0.042751 |
0.037166 |
0.020411 |
0.01491 |
0.011922 |
0.00887 |
0.011303 |
| NPRCC |
0.0392 |
0.0373 |
0.031599 |
0.028771 |
0.020463 |
0.016398 |
0.016504 |
| Test Condition : C-24/ 23/ 50 |
Measurement Equipment : RF Impedance/ Material Analyzer 4291A
(Hewlett Packard) |
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| The Manner of Lay-Up |
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| Lamination |
| Recommended press cycles : |
| A. 2T2P (2 temperature step/ 2 pressure step) |
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| B. 1T2P (1 temperature step/ 2 pressure step) |
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| C. Vacuum |
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Vacuum (mmHg) |
Time (min) |
| step 1 |
760 |
0 |
| step 2 |
≦50 |
1-5 |
| step 3 |
≦50 |
40-60 |
| Suggestions : |
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Heating rate of material between 70°C and 140°C, 1-3°C/ min is acceptable. |
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Temperature of material over 170°C must be held for at least 40 min to allow epoxy resin to fully cure. |
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Cooling rate of material should be kept under 2.5°C/ min when the temperature of material is over 100°C, in order to avoid introducing twist. |
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A vacuum of less than 50 mmHg will be needed to eliminate voids. |
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CAF-Resistance Materials |
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